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Wafer Bonding Equipment Market to Reach USD 620 Million by 2034 Driven by 3D IC and MEMS
global Wafer Bonding Equipment Market was valued at USD 317 million in 2024 and is projected to reach USD 620 million by 2034, at a CAGR of 7.1% during the forecast period 2026-2034. Consistent growth reflects rising complexity in advanced packaging and heterogenous integration across semiconductors. Wafer bonding equipment comprises precision semiconductor processing tools that permanently...
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