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300 mm Wafer FOUPs and FOSBs Are Becoming the Silent Backbone of Advanced Semiconductor Fabs by 2034
 global 300 mm Wafer FOUP and FOSB market is gaining strategic importance as semiconductor manufacturers accelerate capacity expansions and automation initiatives worldwide. Valued at 730 million in 2026, the market is projected to reach 1,215 million by 2034, growing at a CAGR of 7.7 percent during the forecast period 2026–2034. Front Opening Unified Pods (FOUPs) and Front Opening...
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